1, product type: single-sided, double-sided and multilayer printed circuit boards (PCB), flexible (soft) of the circuit board, blind buried plate.
2, Max size: single panel, double panel: 1000mm * 600mm MLB: 600mm * 600mm
3, the maximum number of layers: 20 layers
4, processing thickness: 0.4mm-4.0mm rigid board flexible board 0.025mm --- 0.15mm
5, the substrate foil thickness: rigid plate 18μ (1 / 2OZ), 35μ (1OZ), 70μ (2OZ) flexible board 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm
6, the common base: FR-4, CEM-3, CEM-1, 94HB, 94VO, poly vinyl chloride, polyester, polyimide ammonium.
7, process capability:
(1) Drilling: Minimum aperture 0.15MM
(2) metal hole: smallest aperture 0.15mm, thickness / aperture ratio of 4: 1
(3) wire width: Minimum width: gold plate 0.075mm, 0.10mm tin plate
(4) Wire spacing: Minimum spacing: gold plate 0.075mm, 0.10mm tin plate
(5) gold plate: nickel layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or according to customer requirements
(6) HASL: tin layer thickness:> or = 2.5-5μ
(7) Milling plate: Line-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.2mm Min Outline Tolerance: ± 0.12mm
(8) socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth: 1-3mm
(9) V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth: thickness 2/3 Minimum size: 80mm * 80mm
(10) Continuity test:
Maximum test area: 400mm * 500mm
Maximum test points: 8000 points
Maximum test voltage: 300V
Maximum insulation resistance; 100M Europe
8, resistance welding :85 --- 105 ℃ / 280 ℃ --- 360 ℃
9, the flexible plate around the curve of resistance / chemical resistance: IPC Printed Circuit in line with international standards